Cadence Design Systems Analysis Sigrity 2024 HF001 (x64)

Sigrity and Systems Analysis 2024.0 Release - Date: 5 Jun 2024

Celsius Studio Introduced
Cadence Celsius Studio, the industry's first complete AI-enabled multi-physics analysis platform for electronic systems, has been introduced in this release. This innovative platform delivers unparalleled capabilities in electro-thermal simulation, warpage and stress evaluation, electronics cooling, and thermal network extraction and simulation. It enables electrical and mechanical/thermal engineers to conduct analysis within a unified platform without the need for geometry simplification, manipulation, or translation. Celsius Studio leverages generative AI optimization through Cadence Optimality Intelligent System Explorer to rapidly explore the design space and converge on the optimal design.
The suite of tools within Celsius Studio enables seamless integration of ECAD and MCAD design files, streamlining workflows and facilitating rapid in-design analysis.
Celsius Studio suite includes the following tools:
-Celsius Layout:Facilitates IR-drop, thermal, and warpage/stress analyses, along with electro-thermal and stress co-simulations of layered structure designs, such as PKGs and PCBs with multiple layers and interconnect vias. It also supports thermal model extraction for use in thermal network simulation and leverages Optimality Intelligent System Explorer-an AI-driven multidisciplinary analysis and optimization (MDAO) technology-for rapid design optimization.
-Celsius 3D Workbench:Enables IR-drop, thermal, and warpage/stress analyses, along with electro-thermal and stress co-simulations of 3D structure designs. It also supports thermal model extraction for use in thermal network simulation and leverages Optimality Intelligent System Explorer- an AI-driven multidisciplinary analysis and optimization (MDAO) technology-for rapid design optimization.
-Celsius 3DIC:Supports the creation of customized 3D-IC designs in schematic view or the import of designs from the Integrity 3D-IC Platform. It provides comprehensive thermal analysis, as well as warpage and stress analysis capabilities for complex 3D-ICs and structures.
-Celsius Electronics Cooling:Addresses challenging thermal/electronics cooling management problems with speed and precision. Celsius Electronic Cooling leverages a powerful computational engine and meshing technology to effectively model and analyze complex designs.
-Celsius Thermal Network:Enables the simulation of thermal networks using thermal models extracted from the Celsius Layout and Celsius 3D Workbench tools. It is particularly useful for conducting macroscopic analysis, system-level calculations, thermal characterization, model calibration, and sensitivity analysis.
Note:All features of Celsius Thermal Solver are fully integrated into Celsius Studio. With additions like Celsius 3DIC, Celsius Electronics Cooling, and Celsius Thermal Network, you can now leverage a full suite of tools for your design and analysis needs.
Note:Celsius Fluid Flow Simulation (Celsius CFD) is now available only via the CelsiusCFD.exe located in the installation hierarchy.
- Improved Optimality Intelligent System Explorer
- In addition to Celsius 3D Workbench, the Optimality Intelligent System Explorer is now supported in Celsius Layout and Celsius Electronics Cooling. Optimality uses artificial intelligence (AI)- driven multidisciplinary analysis and optimization (MDAO) technology that allows you to optimize your designs quickly and efficiently without compromising on accuracy. The updated Optimality dialog box supports a variety of design studies, such as parameter optimization, Monte Carlo analysis, sweep analysis, and sensitivity analysis.
- Thermal Network Extraction Support
- Celsius 3D Workbench and Celsius Layout now support thermal network extraction to provide simplified models for macroscopic analysis, system-level calculations, thermal characterization, model calibration, and sensitivity analysis. The extracted models can be imported into the Celsius Thermal Network for thermal network simulation studies.
- Advanced Warpage and Stress Analysis Studies
- You can now conduct warpage and stress analysis studies in Celsius Layout, Celsius 3D Workbench, and Celsius 3DIC. When conducting warpage and stress analysis studies in Celsius 3D Workbench, you now have the ability to specify evaluation temperature distributions across multiple time steps. Additionally, the Structural tab in the Material library has been updated to allow for the specification of additional structural properties. You can also examine the impacts of line loads, line displacements, and line constraints during warpage and stress analysis.
Clarity 3D Solver
-Clarity 3D-IE Layout Workflow Introduced:A new workflow, Clarity 3D-IE Layout, has been added to Clarity 3D Layout. Clarity 3D-IE Layout is part of the Cadence® Clarity 3D Solver product and is designed to extract S-parameters for Power-Integrity (PI) and Signal-Integrity (SI) analysis for laminated design structures, such as PCB designs and planar microwave RF designs.
-Integration of Near and Far Fields:The near and far field results have been consolidated under a single GUI in both Clarity 3D Layout and Clarity 3D Workbench. This allows you to view and modify the near and far-field results in a single window.
-S-Matrix Convergence Support:Clarity 3D Layout and Clarity 3D Workbench now support adaptive mesh refinement (AMR) based on deltaS variations of S-parameters magnitude, phase, or both magnitude and phase. This feature can be used to perform a convergence check on RF/mW filters and related circuits, such as diplexers, multiplexers, and matching networks.
-Optimality Intelligent System Explorer Enhanced:The following enhancements have been made in Optimality Intelligent Explorer:
. In the Function table, the method of defining measurement functions has been replaced with a newly designed centralized GUI that allows you to specify the built-in quantities, including the single mode and differential mode S, Y, and Z parameters, TDR, and far-field.
. Far-field functions, such as E-Field, Gain, Realized Gain, Directivity, Radiation Intensity, Axial Ratio, Emission Descriptions, and antenna parameters, are now supported.
. Three new optimization templates have been added for ease of use.
-Area and Wave Port Options Consolidated under the Port Dialog Box:The area port and wave port options are now available in the Port dialog box as tabs. This allows you to set up and manage the port options from a single dialog box.
-Robustness and Efficiency Improvement in Meshing:The robustness and efficiency in meshing have been improved in both the initial mesh and adaptive mesh refinement (AMR) stages.
Clarity 3D Transient Solver
-Tcl Commands Documentation Viewer:A new window, Tcl commands documentation, has been added that lets you view the detailed documentation of all the supported Tcl commands.
-Advanced User Interaction Support:Clarity 3D Transient Solver leverages an interactive mode that lets you conveniently change the properties of a geometry by selecting a single point or two points on the 3D modeler canvas. This mode offers ease and convenience over the traditional method of specifying properties in the Translate dialog box.

Broadband SPICE
-BBS Engine with Passivity Mode IV:Passivity mode IV has been added to Broadband SPICE, and you can select the Passivity mode IV option in Extraction settings in the Options form. This mode supports the BBS extraction engine. It employs an advanced vector fitting and passivity enforcement method that helps in getting an accurate fitted model in BBS engine for S-parameters with complex low-frequency behaviors.
Celsius PowerDC
-Multi-Board Current-Limited IR Drop Analysis:A new workflow, Multi-Board Current-Limited IR Drop Analysis, has been added to PowerDC. It will help you in performing current-limited IR drop analysis for multiple boards.
-Group Distribution Description Results by Net:To group distribution Description results by net, select the One Description for each power and one Description for ground check box in the Options form. This would help you in checking for hot/cold spots in your report.
-Resistance Measurements Wizard Revamp:Measure the resistance of only power or ground nets from one component to another. Select one of the resistance network topologies out of Lumped to Lumped (Partial/Loop), Lumped to Multiple (Partial/Loop), Multiple to Lumped (Partial/Loop), and Multiple to Multiple (Partial/Loop) in the Set up Resistance Measurements wizard.
-Open Multiple Windows Simultaneously in Multi-Board Workflows:Open each layout block in a separate window now and also, up to three windows can be opened simultaneously. Modify the design setup and view results in these windows. Right-click on a block and select Load in New Window to open a new window.
PowerSI
-Generate Accurate Results using Clarity 3D-IE Solver in PowerSI:In PowerSI, you can now use the Clarity 3D-IE solver feature to generate accurate simulation results while creating cutting polygons for parallel tab traces. To do this, select the Enable Cutting Clarity Block (Clarity 3D-IE license required) check box from the Special Handling page in the Options dialog box. For creating cutting polygons for parallel tab traces, you must check for the following conditions:
. The via, pad, wirebond, or lead in each polygon should not touch the tab trace of the selected nets.
. Each selected net should have two intersection points only with a cutting polygon.
. Any part of a trace cannot fall in two or more cutting polygons at the same time.
SPEEDEM
-High-Performance Computing (HPC) Support for SPEEDEM:To comply with HPC regulations, all the workflows in SPEEDEM will utilize Generation II licenses to expedite the simulation process. To do so, a new workflow item called Set up Computer Resources has been added to the Simulation schema.
XcitePI
-Port and Probe Settings:Two new options, Port and Probe, have been added under Output Setup in the workflow pane. Select these options to specify the port or probe settings of your circuit.
-Loading GDS Files in XcitePI:Perform various operations such as loading settings from the log file, modifying the file path for the layer map file, and so on, on the GDS files before loading them in XcitePI. This will allow easier file opening in XcitePI, which is more consistent with the Gds to Spd Translator.
Layout Workbench
-Python Commands:Use Python commands to automate tasks in the Layout Workbench tools. Python is a simple and easy-to-use platform and provides Layout Workbench functions for even those tasks that are not possible to do using Tcl. A new pane, Python Command, has been added for this.
-Improved Graphical User Interface:A new option, Enable New UI/UX, has been added in the Choose License Suites dialog box that allows you to open an improved Layout Workbench GUI. In the new GUI, the toolbar icons have been enhanced and rearranged. In addition, new buttons have been added on the right of the GUI that allow you to show or hide the related pane in the GUI.
Cadence Sigrityprovides a rich set of gigabit signal and power network analysis technologies, including a unique power-aware signal integrity analysis capability for system, printed circuit board (PCB), and IC package designs. The combination of Sigrity analysis technologies with Cadence Allegro and OrCAD design tools will provide a comprehensive front-to-back integrated flow to enable system and semiconductor companies to deliver high-performance devices employing gigabit interface protocols such as DDR and PCI Express. The integrated solution will particularly benefit customers delivering electronic systems in high-growth markets such as mobile multimedia devices and cloud computing infrastructure.
Systems Analysisproducts complement Sigrity tools and are focused on complete systems. Thermal, EMI, RF, and extraction simulations include design data beyond ECAD and often include MCAD components such as antennas, cables, connectors and enclosures.
Cadence Sigrity: How to Avoid Power Delivery Problems in your PCBs
Ensure uniform current density in your design and put a stop to the additional time and money spent on troubleshooting hard to find power delivery network issues in the lab with Allegro In-Design Analysis powered by Sigrity.
Cadenceis a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world's most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For eight years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work.